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Thermal Design Of LED
Jun 14, 2017

LED cooling design materials and components are mainly thermal design materials have thermal substrate, condensation layer materials and cooling device 3 kinds.

The function of the heat dissipation substrate is connected with the hot layer inside the LED, and the heat is exported and distributed, which is the technical means to solve the problem that the circuit connection between the unit led and the heat dissipation channel are independent. The thermal substrate has a metal PCB, but there is a large expansion coefficient and relatively independent of the problem to take the technical means. The heat dissipation substrate has many problems such as large composite coefficient of metal PCB and metal base and large relative density. Metal Matrix Composite is an improved type of metal PCB, which has the characteristics of high thermal conductivity, small relative density and adjustable expansion coefficient.